Currently designing a custom magnetic encoder PCB with a AS5047D. Should I leave the area under the IC free from any fills/pours? Can’t find anything about this on the datasheet (https://ams.com/documents/20143/36005/AS5047D_DS000394_2-00.pdf/c7225c06-112f-82c5-4471-17a2711a7f0e) of the AS5047D. From what I can read the opinions are quite diverse on this question; Reddit - Dive into anything
Interested to know what some people here do/say about it